Faculty Notes

Rick Sturdivant, Ph.D.

March 13, 2017
Sturdivant, R., Bogdon, A., & Chong, E. K. P. (2017, February). Balancing thermal and electrical packaging requirements for GaN microwave and millimeter-wave high power amplifier modules. Journal of Electronics Cooling and Thermal Control, 7(1). doi: 10.4236/jectc.2017.71001

Faculty Details

Rick Sturdivant
Assistant Professor, Department of Engineering and Computer Science
Adjunct Professor, Department of Mathematics and Physics
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