Rick Sturdivant, Ph.D.
March 13, 2017
Sturdivant, R., Bogdon, A., & Chong, E. K. P. (2017, February). Balancing thermal and electrical packaging requirements for GaN microwave and millimeter-wave high power amplifier modules. Journal of Electronics Cooling and Thermal Control, 7(1). doi: 10.4236/jectc.2017.71001
Assistant Professor, Department of Engineering and Computer Science
Adjunct Professor, Department of Mathematics and Physics